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| (R) TMM 6263 SMALL SIGNAL SCHOTTKY DIODE DESCRIPTION Metal to silicon junction diode featuring high breakdown, low turn-on voltage and ultrafast switching. Primarly intended for high level UHF/VHF detection and pulse application with broad dynamic range. ABSOLUTE MAXIMUM RATINGS (limiting values) Symbol VRRM IF IFSM Tstg Tj TL Parameter Repetitive Peak Reverse Voltage Forward Continuous Current Surge non Repetitive Forward Current Storage and Junction Temperature Range Maximum Temperature for Soldering during 15s Ti = 25 C tp 1s MINIMELF (Glass) Value 60 15 50 - 65 to 200 -65 to 200 260 Unit V mA mA C C THERMAL RESISTANCE Symbol Rth(j-l) Junction-leads Test Conditions Value 400 Unit C/W ELECTRICAL CHARACTERISTICS STATIC CHARACTERISTICS Symbol VBR VF* Tamb = 25C Tamb = 25C Tamb = 25C IR* Tamb = 25C Test Conditions IR = 10A IF = 1mA IF = 15mA VR = 50V Min. 60 0.41 1 0.2 A Typ. Max. Unit V V DYNAMIC CHARACTERISTICS Symbol C Tamb = 25C Tamb = 25C Test Conditions VR = 0V IF = 5mA f = 1MHz Krakauer Method Min. Typ. Max. 2.2 100 Unit pF ps * Pulse test: tp 300s < 2%. Matched batches available on request. Test conditions (forward voltage and/or capacitance) according to customer specification. August 1999 Ed: 1A 1/3 TMM 6263 Figure 1. Forward current versus forward voltage (typical values). Figure 2. Capacitance C versus reverse applied voltage VR (typical values). Figure 3. Reverse current versus ambient temperature. Figure 4. Reverse current versus continuous reverse voltage (typical values). 2/3 TMM 6263 PACKAGE MECHANICAL DATA MINIMELF Glass DIMENSIONS A REF. Millimeters Min. Typ. 3.40 1.60 0.45 1.50 Max. 3.6 1.62 0.50 Min. 0.130 0.063 0.016 Inches Typ. 0.134 0.063 0.018 0.059 Max. 0.142 0.064 0.020 / OB A B C 3.30 1.59 0.40 C C D FOOT PRINT DIMENSIONS (Millimeter) 2 2.5 5 Marking: ring at cathode end. Weight: 0.05g Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 3/3 |
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